TECHNOLOGIES
  • BLIND AND BURIED VIAS
  • BGA/CSP SUBSTRATES
  • HIGH DENSITY BOARDS
  • MIXED TECHNOLOGY / MAXIMUM DENSITY
  • IMPEDANCE CONTROL
  • RF / DIGITAL HYBRIDS
  • CUSTOM & PROTOTYPE DESIGNS
  • SPLIT PLANES
  • CRITICAL BANDWIDTHS / SIGNALS / FREQUENCIES
  • MATCHED PAIR-SPECIFIC LINE LENGTHS
  • REVERSE ENGINEERING AVAILABLE
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